Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

FR4

Epoxy resin / fiberglass fabric

gold

Gold is a chemical element. It has the element symbol Au and the atomic number 79. It stands in the periodic table of the elements in the 1st subgroup (copper group) and belongs to the transition metals. Gold was one of the first metals processed by humans. More than 40 percent of the gold mined comes from China, Australia, the United States and Canada. Gold most often occurs as a native metal in nature. © 2021 SUBSTRATEC. All Rights Reserved.


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Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Polytec EP 630 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.

Polytec TC 411 - Thermally Conductive Adhesive
Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

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