Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

FR4

Epoxy resin / fiberglass fabric

magnets

Magnets


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Kisling 1665
Adhesive Bonding Technology

1665 is a non-sagging, two-part methacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.

Araldite® 2051
Adhesive Bonding Technology

Two component toughened methacrylate adhesive system. Application and curing under water and in humid areas.

tesa® 64905
Adhesive Bonding Technology

0.5 mm double-sided PE foam tape for primerless mounting of automotive exterior and interior parts.

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