Bonding FR4 to copper

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

FR4

Epoxy resin / fiberglass fabric

copper

Copper


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Kisling 7430
Adhesive Bonding Technology

Universal, high strength product with excellent adhesion to metals. May be used also for other materials like glass, ceramic and hard plastics.

Polytec EP 630 - Unfilled Epoxy Adhesive
Adhesive Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.

AKEPOX® 5030
Adhesive Bonding Technology

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