Bonding FR4 to SMC

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

FR4

Epoxy resin / fiberglass fabric

SMC

Sheet Molding Compounds


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Kisling 1665
Adhesive Bonding Technology

1665 is a non-sagging, two-part methacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.

MD Megabond 2000
Adhesive Bonding Technology

Bonds metal, stone, woods, plastics and ceramics. Extremely high strength, weatherproof, easy to use.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

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