Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

SMC

Sheet Molding Compounds

zinc (also galvanized materials)

Zinc (also galvanized materials)


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

ergo 1665
Bonding Technology

ergo 1665 is a non-sagging, two-part methacrylate adhesive designed for structural bonding of thermoplastic, metal, and composite assemblies.

COSMO PU-160.110
Bonding Technology

COSMO PU-160.110, constructional adhesive with hard and tough glued joint, is used in the wood processing, in the dry construction for the bonding of overlapping edges of floor pavement elements or as surface adhesive for a lot of industrial applications.

KEOL-EP 261
Bonding Technology

A versatile easy to use solvent free epoxy adhesive, which can be used to bond or repair most materials such as wood, metal, glass, ceramic, plastics and rubbers.

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