Bonding SMC to magnesium

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

Search engine for adhesives technologies >>>

Search engine for surface treatment >>>

Search engine for dispensing and processing systems >>>


Features

SMC

Sheet Molding Compounds

magnesium

Magnesium


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

MD MEGABOND 3000
Adhesive Bonding Technology

Excellent resistant to hydrocarbons, acids and bases (3-10ph), salt solutions.

Kisling 7490
Adhesive Bonding Technology

7490 is a black, toughened, pasty epoxy resin for application with composite or metal parts.

More results

» See more results