Bonding EP to EPM/EPDM

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

EP

Epoxy resin

EPM/EPDM

Ethylene propylene (diene) rubber


Preview results

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Born2Bond™ Structural
Adhesive Bonding Technology

Born2Bond™ Structural is a high-strength hybrid adhesive that provides a fast fixture time at room temperature while maintaining good processability and bond gaps up to 5mm.

Born2Bond™ Flex
Adhesive Bonding Technology

Born2Bond™ Flex is a flexible, elastic and low-odor, instant adhesive with exceptional adhesion to a very broad range of materials and surfaces.

RAKU® PUR 49-3000
Adhesive Bonding Technology

RAKU® PUR 49-3000 A with RAKU® PUR 49-2030 B is a solvent-free, two-component reaction adhesive that cures at room temperature. The cured adhesive is weather-resistant and is characterized by a high resistance to media and chemicals.

Born2Bond™ Light Lock HV
Adhesive Bonding Technology

Born2Bond™ Light Lock HV is a low-odor, low-blooming, dual curing (contact and lightcuring), cyanoacrylate adhesives.

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