Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Epoxy resin



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tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Bonding Technology

Excellent resistant to hydrocarbons, acids and bases (3-10ph), salt solutions.

epple-easy 5610-new
Bonding Technology

2-part solvent-free adhesive on epoxy basis for easy mixing an applicating, autmatic mixing with dual cartridge, high elastic.

epple 5601
Bonding Technology

2-part solvent-borne adhesive on epoxy basis for bonding of metals and plastics. Low viscosity, long pot life, rather rigid adhesive joint of medium toughness.

epple-easy 5612-new
Bonding Technology

2-part solvent-free adhesive on epoxy basis. Easily mixing and applicating, no manual mixing, can be used as an adhesive and cast resin. Transparent.

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