Bonding EP to magnesium

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

EP

Epoxy resin

magnesium

Magnesium


Preview results

ARALDITE® 2080 - 05
Adhesive Bonding Technology

A low odor, non-flammable, and primer-free acrylate adhesive with exceptional bond performance and a low toxicity profile.

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Kisling 7430
Adhesive Bonding Technology

Universal, high strength product with excellent adhesion to metals. May be used also for other materials like glass, ceramic and hard plastics.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

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