Bonding EP to UP

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

EP

Epoxy resin

UP

Unsaturated polyester resins


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

DuploCOLL® 5015
Adhesive Bonding Technology

Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.

SCIGRIP - SG300
Adhesive Bonding Technology

SCIGRIP® SG300 Series Methacrylate Adhesives are two-component, 10:1 mix ratio products for bonding metals, composites and other plastic parts.

Merbenit TS40 transparent
Adhesive Bonding Technology

Merbenit TS40 is a transparent, elastic adhesive with excellent sealing properties. Adheres thanks SMP base to various materials and surfaces in the interior area.

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