Bonding EP to UP
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Unsaturated polyester resins
A low odor, non-flammable, and primer-free acrylate adhesive with exceptional bond performance and a low toxicity profile.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Merbenit 2K20 is a self-leveling 2-components sealing compound based on SMP.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.