Bonding HPL to HPL
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
High pressure laminate
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.
MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.
Merbenit SK212 is an elastic adhesive with high initial tack and strength. Thanks SMP base especially suitable for bondings where short handling strength is required; for example for bonding windscreens on vehicles. Merbenit SK212 is certified after the branch standards NCAP and FMVSS212.