Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

PUR (higher degree of cross-linking)

Polyurethane (high degree of cross-linking)

gold

Gold is a chemical element. It has the element symbol Au and the atomic number 79. It stands in the periodic table of the elements in the 1st subgroup (copper group) and belongs to the transition metals. Gold was one of the first metals processed by humans. More than 40 percent of the gold mined comes from China, Australia, the United States and Canada. Gold most often occurs as a native metal in nature. © 2021 SUBSTRATEC. All Rights Reserved.


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tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

MD MEGABOND 3000
Bonding Technology

Excellent resistant to hydrocarbons, acids and bases (3-10ph), salt solutions.

COSMO HD-200.101
Bonding Technology

Elastic 2-component STP-adhesive for a multitude of assembly bonding applications, with homogeneous through-hardening and reliable process time during the application.

tesa® 64905
Bonding Technology

0.5 mm double-sided PE foam tape for primerless mounting of automotive exterior and interior parts.

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