Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Polyurethane (high degree of cross-linking)
Silver (Ag) is a chemical element of the 5th period. It is characterized by the highest electrical conductivity of all elements and the highest thermal conductivity of all metals. Silver is one of the soft and malleable metals. Like all precious metals, silver is one of the heavy metals. In most cases silver is won from ores of copper, copper-nickel, lead or lead-zinc but also a refining of silver (electrolytic copper cleaning). © 2021 SUBSTRATEC. All Rights Reserved.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.
Excellent resistant to hydrocarbons, acids and bases (3-10ph), salt solutions.
Elastic 2-component STP-adhesive for a multitude of assembly bonding applications, with homogeneous through-hardening and reliable process time during the application.