Bonding PUR high degree of crosslinking to BMC

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

PUR (higher degree of cross-linking)

Polyurethane (high degree of cross-linking)

BMC

Bulk molding compounds


Preview results

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

MD Megabond 2000
Bonding Technology

Bonds metal, stone, woods, plastics and ceramics. Extremely high strength, weatherproof, easy to use.

COSMO PU-160.110
Bonding Technology

COSMO PU-160.110, constructional adhesive with hard and tough glued joint, is used in the wood processing, in the dry construction for the bonding of overlapping edges of floor pavement elements or as surface adhesive for a lot of industrial applications.

MD CLEARBOND
Bonding Technology

A low odour, clear Acrylic adhesive with medium viscosity, shock- and vibration-proof.

MD MEGABOND 3000
Bonding Technology

Excellent resistant to hydrocarbons, acids and bases (3-10ph), salt solutions.

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