Bonding UP to SBR
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Unsaturated polyester resins
Medium to high viscous and nearly odourless glue, which shows less blooming or whitening than normal grades. Suitable for bonding of jewellery or crystal into carrier and recommended, wherever visible traces of glue must be avoided.
Only a few drops of this super-fast instant glue suffice for most applications in order to achieve powerful assemblies. The practical PE-bottles make possible a dot-like accurate application of the adhesive onto the parts to be bonded.
1-part room-temperature curing, highly flexible polyurethane-adhesive with excellent electrical conductivity. It is used in micro electronics, hybrid and electronic applications.
Black cyanoacrylate adhesive, which has been developed for all applications under thermal and/ or climatic conditions.
Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.