Microelectronics / optics / sensor systems - camera bondings
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
High performance HMPUR with high initial bonding strength and excellent environmental resistance.
Instant adhesive with dual cure system (light curing).
High performance HMPUR with excellent fluidity and high bonding on metal and glass.
Labelfree, low blooming, high viscous instant adhesive.