Microelectronics / optics / sensor systems - camera bondings

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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camera bondings

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Born2Bond™ HMPUR HHD 6002
Adhesive Bonding Technology

High performance HMPUR with high initial bonding strength and excellent environmental resistance.

Born2Bond™ Light Lock HV
Adhesive Bonding Technology

Instant adhesive with dual cure system (light curing).

Born2Bond™ HMPUR HHD 6009
Adhesive Bonding Technology

High performance HMPUR with excellent fluidity and high bonding on metal and glass.

Born2Bond™ Ultra HV
Adhesive Bonding Technology

Labelfree, low blooming, high viscous instant adhesive.

Polytec EP 610-2 – Unfilled Epoxy Adhesive
Adhesive Bonding Technology

Polytec EP 610-2 is used for stress free bonding of large optical components with different CTE´s.

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