Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

DELO KATIOBOND 4552
Bonding Technology

Light-activated EP adhesive, low-viscous

Polytec PU 1000 - Electrically Conductive Polyurethane Adhesive
Bonding Technology

1-part room-temperature curing, highly flexible polyurethane-adhesive with excellent electrical conductivity. It is used in micro electronics, hybrid and electronic applications.

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