Microelectronics / optics / sensor systems - bonding of micro-switches
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Adhesive and sealant with high initial adhesion | temperature resistant.
KIWOTHERM® D 123 is a screen printable, heat activated adhesive for the bonding of plastic film to one another, or to paper, cardboard and textiles.
KIWOPRINT® UV Series is a high quality, pressure sensitive adhesive for the production of self-adhesive components made of rigid PVC, glass metal and film made of polycarbonate, polyester and pre-treated polyethylene and polypropylene.
Universal epoxy resin adhesive | viscous | self-levelling | very short pot life | fast-curing | transparent.