Microelectronics / optics / sensor systems - bonding of micro-switches
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Adhesive and sealant with high initial adhesion | temperature resistant.
Universal epoxy resin adhesive | viscous | self-levelling | very short pot life | fast-curing | transparent.
Born2Bond™ Structural is a high-strength hybrid adhesive that provides a fast fixture time at room temperature while maintaining good processability and bond gaps up to 5mm.
Cyanoacrylate adhesive for special requirements | high-temperature-resistant | high viscosity | slow curing | cures with residual elasticity | high peel and impact strength.