Microelectronics / optics / sensor systems - bonding of sensor bondings

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

sensor bondings

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Born2Bond™ HMPUR HHD 6002
Adhesive Bonding Technology

High performance HMPUR with high initial bonding strength and excellent environmental resistance.

Born2Bond™ Structural
Adhesive Bonding Technology

Tough 2K instant adhesive with long open time.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

Born2Bond™ Flex
Adhesive Bonding Technology

Flexible 2K Instant adhesive for fast bonding.

Born2Bond™ Light Lock HV
Adhesive Bonding Technology

Instant adhesive with dual cure system (light curing).

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