Microelectronics / optics / sensor systems - bonding of sensor bondings
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.
Do your company’s projects require surface pretreatment, application systems or adhesive technologies? Is there a need for further training for hand-operated or robotic bonding processes?
Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.