Microelectronics / optics / sensor systems - bonding of sensor bondings

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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sensor bondings

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Polytec TC 411 - Thermally Conductive Adhesive
Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

Substratec® - Project support
Consulting

Do your company’s projects require surface pretreatment, application systems or adhesive technologies? Is there a need for further training for hand-operated or robotic bonding processes?

Polytec TC 417-2 - Thermally Conductive Adhesive
Bonding Technology

Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.

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