Microelectronics / optics / sensor systems - bonding of wires & cables
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Features
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Adhesive and sealant with high initial adhesion | temperature resistant.
Universal epoxy resin adhesive | viscous | self-levelling | very short pot life | fast-curing | transparent.
Cyanoacrylate adhesive for special requirements | high-temperature-resistant | high viscosity | slow curing | cures with residual elasticity | high peel and impact strength.
Structural Acrylic Adhesive | fast-curing | high strength | impact resistant | residual elasticity.
High temperature resistant epoxy adhesive | high thermal conductivity | long pot life.