AS1420 Silicone Adhesive Sealant

Adhesive Bonding Technology

Non-Corrosive Neutral Cure Adhesive Sealant and Potting Material (Electronic Grade) - This is a heat cured, non-corrosive, neutral cure, 1-part, silicone adhesive sealant. It is one in a range of Addition cure products which are solvent free.

It exhibits primerless adhesion to many substrates when cured at temperatures above 100°C. It cures to form a very tough resilient silicone elastomer. This product will not corrode copper or its alloys and is suitable for use with electronic components.

Key Features

  • Fast heat cure
  • Excellent thermal conductivity
  • Non corrosive
  • Tough protective rubber

Application

  • Electronics
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CHT Germany GmbH
Adhesive Bonding Technology

CHT further strengthened its position as a global producer of speciality silicone elastomers and rubber with the acquisition of the ICM silicones Group in 2017 which included Quantum Silicones, ACC Silicones, ICM Products, Amber Silicones and Treco SRL.

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Features

Adhesive and sealant systems
Adhesive
Sealant
1-part systems
silicone (RTV-1)
Components
1-part systems
Metals
copper
Size of application area
cm²-/cm³ range - component
m² range - workpiece
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / minutes
16-30 min
(Mixed) viscosity
medium viscosity
Packaging unit
cartridge (1- or 2-part)
hobbock
colour and colour fastness
grey
Shore-A
Sh-A 61 to 80
conductivity
heat-conductive
deformation capability
≤ 150%

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