SilSo Cool 21005 Encapsulants
Adhesive Bonding Technology
Silicone gap filler - This is a two part, thermally conductive, thixotropic material, which cures at room temperature or can be accelerated with heat.
It is specifically formulated to give low hardness and resistance to slump and features low and high temperature mechanical and chemical stability. It remains flexible and has a natural low level tack, ideal for applications where a strong mechanical or chemical bond is not required. It has a controlled volatile content and an easy mix ratio by volume or weight.
Key Features
- Thermally conductive
- Soft material to compensate for CTE mismatch
- Flame resistant
- Electrically insulating
Application
- TIM gap filler
CHT further strengthened its position as a global producer of speciality silicone elastomers and rubber with the acquisition of the ICM silicones Group in 2017 which included Quantum Silicones, ACC Silicones, ICM Products, Amber Silicones and Treco SRL.
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