Diamelt Series

Adhesive Bonding Technology

Pressure-sensitive adhesives based on synthetic resins.

The Diamelt product range has the following properties depending on the product:

  • for applications such as construction, elastic attachment and positioning in the non-woven industry as well as tape industry
  • good thermal stability
  • excellent adhesion on a variety of materials
  • high cohesion
  • high color stability in the melt
Find out more
cph Deutschland Chemie GmbH
Adhesive Bonding Technology

Contact Form

Features

Adhesive and sealant systems
Adhesive
1-part systems
pressure-sensitive adhesive (PSA)
Size of application area
cm²-/cm³ range - component
food approval
FDA-guideline 21 CFR 175.105
Construction Components & Elements / expendable materials
adhesive tapes

The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable system that may be available. SUBSTRATEC gives no guarantee that the system suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant manufacturer or supplier. See for further information Terms of Use.