epple-easy 5711

Adhesive Bonding Technology

epple 5711 is a two-component, solvent-free adhesive on the basis of polyurethane.

  • Low-viscous adhesive
  • Applied by means of a dual cartridge
  • Easy to applicate
  • High adhesive strength to metals, light metals, non-ferrous metals, paper, cardboard and wood

Application: Mainly used for the bonding of combinations out of metal and plastic, as well as for the fastening and protection of electronic components in circuit boards.

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E. Epple & Co. GmbH
Adhesive Bonding Technology

At epple we are passionate about our tradition of offering a wide range of industrial sectors the sealing compounds, adhesives and casting resins they need for optimal technical solutions.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Components
2-part systems
2-part systems
2-part polyurethane
High Performance Plastics
PPS
PSU
PES
Thermoplastics
ABS
ASA
EPS
PA
PA (PA 6)
PA (PA 6.6)
PA (PA 12)
PBT
PC
PET
PMMA
PPE
PS
PUR (lower degree of cross-linking)
PVC (harder perfomance)
PVC (softer perfomance)
SAN
SB
XPS (rigid foam)
Elastomers
CR
NBR
NR
SBR
Thermosetting Plastics
EP
HPL
MF
PF
PUR (higher degree of cross-linking)
UP
Composites
CRP
BMC
FR4
GRP
SMC
Metals
aluminium
plumb
bronze
chromium
gold
cast iron
copper
magnesium
brass
nickel
platinum
silver
silicium
steel - blasted SA 2,5
steel - chromated
steel - stainless
steel - galvanised
titanium
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
glass
ceramics
mosaic & tiles
porcelain
emaille
Fabrics & Leather
felt
jute
leather
fleece
Paper & Cardboard
dispersion-coated cardboards
foils
FR2 - synthetic resin bonded paper
coated cardboards
grey board
paper
PE-coated boards
corrugated cardboard
Wood & Timber
veneer
laminate - HPL
laminate - CPL
cork
solid timber - primed, painted, coated
solid timber - untreated
MDF - medium density fiberboard
multiplex board
OSB - oriented strand board
parquet
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
room temperature curing
Pot life @ +20/23°C - Minimum / minutes
31-59 min
(Mixed) viscosity
high viscosity
Packaging unit
cartridge (1- or 2-part)
temperature resistance <0°C (approx.)
from -20°C
temperature resistance >0°C (approx.)
to +100°C
colour and colour fastness
colour spectrum dark
Ecological requirements
VOC-free
Application Types
dot application
line, bead application
Anchoring & Fixing
screw thread - through hole
screw thread - pocket hole bore
chemical screw retention
chemical anchoring systems

The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable system that may be available. SUBSTRATEC gives no guarantee that the system suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant manufacturer or supplier. See for further information Terms of Use.