ARALDITE® 2015-1
Adhesive Bonding Technology
Araldite® 2015-1 is a two component, room temperature curing paste adhesive giving a resilient bond.
It is thixotropic and non-sagging up to 10 mm thickness. It is particularly suitable for SMC and GRP bonding.
- Toughened paste
- Ideal for bonding GRP, SMC and dissimilar substrates
- Gap filling, non-sagging up to 10mm thickness
- Good resistance to weathering
Whatever bonding task is in front of you, you can rely on the ARALDITE® adhesives
Contact Form
Features
The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable system that may be available. SUBSTRATEC gives no guarantee that the system suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant manufacturer or supplier. See for further information Terms of Use.