PX-309

Adhesive Bonding Technology

1-part bismaleimide adhesive (BMI). High temperature resistant.

Flexibilized 1K BMI adhesive film. HocPX-309 is a solvent-free, hot-curing 1K bismaleimide adhesive with high media and temperature resistance. The adhesive is not filled and is suitable for high-temperature-resistant, constructive bonding of metals, glass and ceramics. Characteristic is its very balanced properties of RT up to 220 °C. It is particularly suitable for continuous loads at elevated temperatures and is very resistant to hydrolysis (sterilizable) as well as to many organic solvents.

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Polymerics GmbH
Adhesive Bonding Technology

Polymerics GmbH is a technology-oriented company that has been involved in the development and manufacture of specialized adhesives, special polymers and products for structural fire protection since 1996.

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Features

Adhesive and sealant systems
Adhesive
1-part systems
bismaleimide (BMI)
Components
1-part systems
Metals
aluminium
steel - stainless
Glass & Ceramic Materials
ceramics
Size of application area
cm²-/cm³ range - component
Curing mechanisms
warm-/hot curing
Pot life @ +20/23°C - Minimum / minutes
31-59 min
Packaging unit
small packaging unit (can, tube, etc.)
temperature resistance >0°C (approx.)
to +220°C
to +240°C
to +250°C
colour and colour fastness
translucent
colour spectrum dark
Ecological requirements
VOC-free

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