PX-309
Adhesive Bonding Technology
1-part bismaleimide adhesive (BMI). High temperature resistant.
Flexibilized 1K BMI adhesive film. HocPX-309 is a solvent-free, hot-curing 1K bismaleimide adhesive with high media and temperature resistance. The adhesive is not filled and is suitable for high-temperature-resistant, constructive bonding of metals, glass and ceramics. Characteristic is its very balanced properties of RT up to 220 °C. It is particularly suitable for continuous loads at elevated temperatures and is very resistant to hydrolysis (sterilizable) as well as to many organic solvents.
Polymerics GmbH is a technology-oriented company that has been involved in the development and manufacture of specialized adhesives, special polymers and products for structural fire protection since 1996.
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