Maintenance - Industrial Facilities - Energy supply - several bondings


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several bondings - energy

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Polytec TC 411 - Thermally Conductive Adhesive
Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

AralditeĀ® 2051
Bonding Technology

Two component toughened methacrylate adhesive system. Application and curing under water and in humid areas.

AralditeĀ® 2015-1
Bonding Technology

Two component, room temperature curing epoxy paste adhesive giving a resilient bond.

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