Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.
Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.
Do your company’s projects require surface pretreatment, application systems or adhesive technologies? Is there a need for further training for hand-operated or robotic bonding processes?
Two component toughened methacrylate adhesive system. Application and curing under water and in humid areas.
Two component, room temperature curing epoxy paste adhesive giving a resilient bond.