Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

several bondings - medical equipments

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Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

Polytec EC 101 - Electrically Conductive Adhesive
Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

Polytec EP 630 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.

Polytec EP 601 - Unfilled Epoxy Adhesive
Bonding Technology

Two-component transparent, , optically clear epoxy adhesive of very low viscosity.

Araldite® 2051
Bonding Technology

Two component toughened methacrylate adhesive system. Application and curing under water and in humid areas.

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