Encapsulation - pottings

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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pottings

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Polytec EP 630 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.

Substratec® - Project support
Consulting

Do your company’s projects require surface pretreatment, application systems or adhesive technologies? Is there a need for further training for hand-operated or robotic bonding processes?

Polytec TC 417-2 - Thermally Conductive Adhesive
Bonding Technology

Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.

Polytec EP 601 - Unfilled Epoxy Adhesive
Bonding Technology

Two-component transparent, , optically clear epoxy adhesive of very low viscosity.

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