Encapsulation - pottings
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Polytec EP 630 - Unfilled Epoxy Adhesive
Adhesive Bonding Technology
Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.
Polytec TC 417-2 - Thermally Conductive Adhesive
Adhesive Bonding Technology
Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.
Araldite® 2011
Adhesive Bonding Technology
ARALDITE ® 2011 adhesive provides you with a well-proven, versatile bonding solution.