Encapsulation - pottings
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Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.
2-Part Encapsulation and Potting Silicone - This is a 2-component, silicone elastomer system specially designed for electronic potting and encapsulation applications.
Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.
ARALDITE ® 2011 adhesive provides you with a well-proven, versatile bonding solution.