Polytec TC 417-2 - Thermally Conductive Adhesive

Adhesive Bonding Technology

Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.

Polytec TC 417-2 has an excellent chemical and moisture resistance. It has an excellent adhesion to glass, metal, ceramic, FR4 and most plastics. The room temperature cure allows to bond temperature sensitive substrates very conveniently. The material can be applied via dispensing or manual application.

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Polytec PT GmbH
Adhesive Bonding Technology

Polytec PT GmbH develops, manufactures and sells special adhesives and thermal interface materials for applications in electronics, electrical engineering, medical technology and the automotive sector.

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Features

Adhesive and sealant systems
Adhesive
Potting
Components
2-part systems
2-part systems
2-part epoxy resins
High Performance Plastics
PSU
PES
Thermoplastics
ABS
ASA
EPS
PA
PA (PA 6)
PA (PA 6.6)
PA (PA 12)
PBT
PC
PE-HD (High Density)
PE-LD (Low Density)
PET
POM
PP
PPE
PS
PUR (lower degree of cross-linking)
PVC (softer perfomance)
SAN
SB
XPS (rigid foam)
Elastomers
CR
EPM/EPDM
NBR
NR
SBR
Thermosetting Plastics
EP
HPL
MF
PF
PUR (higher degree of cross-linking)
UP
Composites
CRP
BMC
FR4
GRP
SMC
Metals
aluminium
plumb
bronze
chromium
gold
cast iron
copper
magnesium
brass
nickel
platinum
silver
silicium
steel - blasted SA 2,5
steel - chromated
steel - stainless
steel - galvanised
titanium
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
glass
ceramics
ceramic (techno-)
mosaic & tiles
emaille
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
room temperature curing
Pot life @ +20/23°C - Minimum / hours
5-12 h
(Mixed) viscosity
high viscosity
Packaging unit
customized packaging
temperature resistance <0°C (approx.)
from -55°C
temperature resistance >0°C (approx.)
to +180°C
colour and colour fastness
colour spectrum dark
black
Shore-D
Sh-D 81 to 100
deformation capability
≤ 10%
Application Types
dot application
line, bead application
Mobility - Land Transportation / engine and drive technology
stator pottings
Mobility - Land Transportation / vehicle electronics
sensor bondings
plugs
White Goods & Consumer Electronics / microelectronics / optics / sensor systems
sensor bondings
plugs
Microtechnology / encapsulation
pottings

The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable system that may be available. SUBSTRATEC gives no guarantee that the system suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant manufacturer or supplier. See for further information Terms of Use.