Polytec PT GmbH

Adhesive Bonding Technology

Polytec PT GmbH develops, manufactures and sells special adhesives and thermal interface materials for applications in electronics, electrical engineering, medical technology and the automotive sector. The product portfolio includes electrically and/or thermally conductive adhesives, thermally conductive gap fillers and UV-curable adhesives based on epoxy resin and acrylates. In addition to an extensive range of standard products, Polytec PT develops and manufactures customer-specific adhesives that are tailored to special requirements.

Ettlinger Str. 30
DE-76307 Karlsbad
Germany

Website

Features

Core competences
Adhesive and sealant technologies
Source of supply for your in-house production
Manufacturer
Sector expertise
Manufacuting industry
Europe
Germany
Companies A-Z
O-P
Adhesive and sealant systems
Adhesive
1-part systems
1-part epoxy resins
1-part polyurethane
acrylate UV Tech
2-part systems
2-part epoxy resins
Chemistry - Coatings
1-parts systems
2-parts systems
Chemical basis
acrylates UV-Tech
epoxy resins
polyurethanes
Adhesive
Manufacturing
Europe
DACH region
Bonding Technologies
manufacturer

Products

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

Polytec EP 601 - Unfilled Epoxy Adhesive
Adhesive Bonding Technology

Two-component transparent, , optically clear epoxy adhesive of very low viscosity.

Polytec EP 610-2 – Unfilled Epoxy Adhesive
Adhesive Bonding Technology

Polytec EP 610-2 is used for stress free bonding of large optical components with different CTE´s.

Polytec EP 630 - Unfilled Epoxy Adhesive
Adhesive Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.

Polytec PU 1000 - Electrically Conductive Polyurethane Adhesive
Adhesive Bonding Technology

1-part room-temperature curing, highly flexible polyurethane-adhesive with excellent electrical conductivity. It is used in micro electronics, hybrid and electronic applications.

Polytec TC 301 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Polytec TC 301 is a standard single component, metal filled, heat curing epoxy adhesive with excellent thermal conductivity.

Polytec TC 411 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

Polytec TC 417-2 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Polytec TC 417-2 is a two component, thermally conductive, electrically insulating epoxy. It is used in various thermal management applications, especially for potting of large volumes.

Polytec TC 430 - Thermally Conductive Adhesive
Adhesive Bonding Technology

Polytec TC 430 is a two component, thermally conductive, electrically insulating epoxy. It is suggested for applications where heat dissipation and insulating properties are required.

Polytec UV 2195 - UV light curing acrylate adhesive
Adhesive Bonding Technology

Polytec UV 2195 is a fast curing, single component, UV-/Visible light curable, medium viscosity acrylic adhesive. It is suitable for impact and vibration resistant bonds.

1-component gap filler, non-crosslinking
Adhesive Bonding Technology

Use our product overview, let yourself be inspired and get a feel for what our gap fillers can do for you.

2-component gap filler, crosslinking
Adhesive Bonding Technology

Use our product overview, let yourself be inspired and get a feel for what our gap fillers can do for you.

Information Desk