2-component gap filler, crosslinking

Adhesive Bonding Technology

Use our product overview, let yourself be inspired and get a feel for what our gap fillers can do for you.

Polytec 2-part gapfillers are thermally conductive, silicone-free and non-abrasive. They are easy and convenient to use for heat sinking and thermal management applications in the electronics and automotive industry, e.g., by filling and leveling gaps between parts that will heat up during operation, and the respective cooling plates.

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Polytec PT GmbH
Adhesive Bonding Technology

Polytec PT GmbH develops, manufactures and sells special adhesives and thermal interface materials for applications in electronics, electrical engineering, medical technology and the automotive sector.

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Features

Adhesive and sealant systems
Adhesive
Potting
Chemistry - Coatings
2-parts systems
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
volumetric
10:1
Curing mechanisms
room temperature curing
chemical curing
Pot life @ +20/23°C - Minimum / days
> 2 d
(Mixed) viscosity
medium viscosity
Packaging unit
cartridge (1- or 2-part)
hobbock
temperature resistance >0°C (approx.)
to +60°C
to +70°C
to +80°C
max temperature exposure short-term
to +120°C
colour and colour fastness
grey
conductivity
heat-conductive
Ecological requirements
silicone-free
Degree of automation
manuel application
semi automatic (hand-operated)
fully automated
Medium nature
filled

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