Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology
Polytec EC101 is a standard two-component, solventfree, heat curing epoxy resin with along pot life and excellent electrical conductivity.
It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.
Polytec PT GmbH develops, manufactures and sells special adhesives and thermal interface materials for applications in electronics, electrical engineering, medical technology and the automotive sector.
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