Polytec EP 610-2 – Unfilled Epoxy Adhesive

Adhesive Bonding Technology

Polytec EP 610-2 is a transparent, two component epoxy adhesive of very low viscosity and high flexibility. Polytec EP 610-2 is used for stress free bonding of large optical components with different CTE´s.

It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology. The material can be applied via dispensing, jet dispensing and manual application.

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Polytec PT GmbH
Adhesive Bonding Technology

Polytec PT GmbH develops, manufactures and sells special adhesives and thermal interface materials for applications in electronics, electrical engineering, medical technology and the automotive sector.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Components
2-part systems
2-part systems
2-part epoxy resins
High Performance Plastics
PSU
PES
Thermoplastics
ABS
ASA
EPS
PA
PA (PA 6)
PA (PA 6.6)
PA (PA 12)
PBT
PC
PET
PMMA
PPE
PS
PUR (lower degree of cross-linking)
PVC (harder perfomance)
SAN
SB
XPS (rigid foam)
Elastomers
NBR
NR
SBR
Thermosetting Plastics
EP
HPL
MF
PF
PUR (higher degree of cross-linking)
UP
Composites
CRP
BMC
FR4
GRP
SMC
Metals
aluminium
plumb
bronze
chromium
gold
cast iron
copper
magnesium
magnets
brass
nickel
platinum
silver
silicium
steel - blasted SA 2,5
steel - chromated
steel - stainless
steel - galvanised
titanium
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
glass
ceramics
mosaic & tiles
porcelain
emaille
Fabrics & Leather
felt
jute
leather
fleece
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
room temperature curing
Pot life @ +20/23°C - Minimum / hours
5-12 h
(Mixed) viscosity
medium viscosity
Packaging unit
small packaging unit (can, tube, etc.)
customized packaging
temperature resistance <0°C (approx.)
from -55°C
temperature resistance >0°C (approx.)
to +150°C
max temperature exposure short-term
to +300°C
colour and colour fastness
translucent
deformation capability
≤ 150%
Application Types
dot application
line, bead application
Mobility - Land Transportation / engine and drive technology
stator pottings
White Goods & Consumer Electronics / microelectronics / optics / sensor systems
camera bondings
LED-lenses
Medical & Biotechnology / medical equipment & accessories
several bondings - medical equipments

The search results from SUBSTRATEC are not sales recommendations and/or professional technical advice. It is only intended to make it easier for the user to pre-select suitable system that may be available. SUBSTRATEC gives no guarantee that the system suggested is successful or suitable for the specific area of application of the user. In the event of any questions regarding the use and suitability for the specific application, the user has the possibility to directly contact the respective technical contact person of the relevant manufacturer or supplier. See for further information Terms of Use.