1-component gap filler, non-crosslinking

Adhesive Bonding Technology

Use our product overview, let yourself be inspired and get a feel for what our gap fillers can do for you.

Polytec 1-part gap fillers are highly thermally conductive, silicone-free paste with nonabrasive fillers. They are easy and convenient to use for reworkable heat sinking and thermal management applications in the electronics and automotive industry, e.g., by filling and leveling gaps between parts that will heat up during operation, and the respective cooling plates.

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Polytec PT GmbH
Adhesive Bonding Technology

Polytec PT GmbH develops, manufactures and sells special adhesives and thermal interface materials for applications in electronics, electrical engineering, medical technology and the automotive sector.

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Features

Adhesive and sealant systems
Potting
1-part systems
silicone-free oil
Components
1-part systems
Metals
aluminium
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
non-crosslinking
(Mixed) viscosity
pasty
Packaging unit
cartridge (1- or 2-part)
hobbock
max. (dry) film thickness
DFT 200-250µm
temperature resistance >0°C (approx.)
to +160°C
to +180°C
to +200°C
colour and colour fastness
yellow
conductivity
heat-conductive
UL Underwriters Laboratories
UL 94 V-0 or 1
Degree of automation
manuel application
semi automatic (hand-operated)
fully automated
Medium nature
filled
Mobility - Land Transportation / engine and drive technology
battery bondings

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