Polytec TC 301 - Thermally Conductive Adhesive
Adhesive Bonding Technology
Polytec TC 301 is a standard single component, metal filled, heat curing epoxy adhesive with excellent thermal conductivity. It was designed for all applications where heat transfer is essential (heat-sinking, aluminum or ceramic packaging etc.).
Polytec TC 301 has a conveniently long pot- and shelf life and is ideal for all dispensing and screen printing applications. TC 301 has an excellent adhesion on metals, ceramic, glass and most plastics. The material can be applied by dispensing or screen and stencil printing.
Polytec PT GmbH develops, manufactures and sells special adhesives and thermal interface materials for applications in electronics, electrical engineering, medical technology and the automotive sector.