Polytec TC 411 - Thermally Conductive Adhesive

Adhesive Bonding Technology

Pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering.

Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.

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Polytec PT GmbH
Adhesive Bonding Technology

Polytec PT GmbH develops, manufactures and sells special adhesives and thermal interface materials for applications in electronics, electrical engineering, medical technology and the automotive sector.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Components
2-part systems
2-part systems
2-part epoxy resins
High Performance Plastics
PSU
PES
Thermoplastics
ABS
ASA
EPS
PA
PA (PA 6)
PA (PA 6.6)
PA (PA 12)
PBT
PC
PE-HD (High Density)
PE-LD (Low Density)
PET
POM
PP
PPE
PS
PUR (lower degree of cross-linking)
PVC (softer perfomance)
SAN
SB
XPS (rigid foam)
Elastomers
CR
EPM/EPDM
NBR
NR
SBR
Thermosetting Plastics
EP
HPL
MF
PF
PUR (higher degree of cross-linking)
UP
Composites
CRP
BMC
FR4
GRP
SMC
Metals
aluminium
plumb
bronze
chromium
gold
cast iron
copper
magnesium
brass
nickel
platinum
silver
silicium
steel - blasted SA 2,5
steel - chromated
steel - stainless
steel - galvanised
titanium
zinc (also galvanized materials)
tin
Glass & Ceramic Materials
glass
ceramics
ceramic (techno-)
mosaic & tiles
emaille
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
room temperature curing
Pot life @ +20/23°C - Minimum / hours
1-2 h
(Mixed) viscosity
pasty
Packaging unit
cartridge (1- or 2-part)
customized packaging
temperature resistance <0°C (approx.)
from -55°C
temperature resistance >0°C (approx.)
to +120°C
colour and colour fastness
colour spectrum bright
white
Shore-D
Sh-D 21 to 40
conductivity
electrically conductive
deformation capability
≤ 30%
Application Types
dot application
line, bead application
White Goods & Consumer Electronics / microelectronics / optics / sensor systems
sensor bondings

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