Vehicle electronics - bonding of micro-cameras
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Born2Bond™ HMPUR HHD 6002 is a high performance adhesive that stands out with high production efficiency, excellent humidity, sebum, temperature and impact resistance.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
Born2Bond™ Light Lock HV is a low-odor, low-blooming, dual curing (contact and lightcuring), cyanoacrylate adhesives.
Born2Bond™ HHD 6009 is a high performance, one-component, solvent-free, moisture curing hot-melt polyurethane adhesive, with excellent flow behavior and high adhesion to metal and glass.