Vehicle electronics - bonding of micro-cameras

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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micro-cameras

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Born2Bond™ HMPUR HHD 6002
Adhesive Bonding Technology

High performance HMPUR with high initial bonding strength and excellent environmental resistance.

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

Born2Bond™ Light Lock HV
Adhesive Bonding Technology

Instant adhesive with dual cure system (light curing).

Born2Bond™ HMPUR HHD 6009
Adhesive Bonding Technology

High performance HMPUR with excellent fluidity and high bonding on metal and glass.

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