Vehicle electronics - bonding of micro-switches

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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micro-switches

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Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

Born2Bondâ„¢ Light Lock HV
Adhesive Bonding Technology

Instant adhesive with dual cure system (light curing).

Born2Bondâ„¢ Ultra HV
Adhesive Bonding Technology

Labelfree, low blooming, high viscous instant adhesive.

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