Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Polyisoprene (natural rubber)

gold

Gold is a chemical element. It has the element symbol Au and the atomic number 79. It stands in the periodic table of the elements in the 1st subgroup (copper group) and belongs to the transition metals. Gold was one of the first metals processed by humans. More than 40 percent of the gold mined comes from China, Australia, the United States and Canada. Gold most often occurs as a native metal in nature. © 2021 SUBSTRATEC. All Rights Reserved.


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MD MK 3000
Bonding Technology

Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.

MD MS 2K Polymer
Bonding Technology

Low odor, permanently elastic, wet on wet applicable, good resistance to oils, fats, water, aliphatic solvents etc.

MD MS Polymer
Bonding Technology

Fast curing, odorless, wet on wet applicable, sanded.

Polytec PU 1000 - Electrically Conductive Polyurethane Adhesive
Bonding Technology

1-part room-temperature curing, highly flexible polyurethane-adhesive with excellent electrical conductivity. It is used in micro electronics, hybrid and electronic applications.

Polytec EP 610 - Unfilled Epoxy Adhesive
Bonding Technology

Polytec EP 610 is a transparent, two-component epoxy adhesive of very low viscosity and high flexibility. It is suggested for applications in optics, fiber optics, optoelectronics, medical and semiconductor technology.

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