Bonding SI to copper

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

SI

Silicones

copper

Copper


Preview results

MD MK 3000
Bonding Technology

Bonds immediately, is the new generation of the mounting adhesive, is not shrinking, is very well suited for natural stones, hardens quickly.

MD MS 2K Polymer
Bonding Technology

Low odor, permanently elastic, wet on wet applicable, good resistance to oils, fats, water, aliphatic solvents etc.

MD MS Polymer
Bonding Technology

Fast curing, odorless, wet on wet applicable, sanded.

ergo 3120
Bonding Technology

Neutral cure one-component RTV silicone formulated for use in a wide range of industrial applications.

tesa® 92108 HiP – High initial Performance
Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

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