Bonding GRP to copper

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

GRP

Glass fiber reinforced plastics

copper

Copper


Preview results

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Adhesive Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

Polytec EP 630 - Unfilled Epoxy Adhesive
Adhesive Bonding Technology

Polytec EP 630 is a 100% solid, two-component, low viscosity, high temperature adhesive, underfill and encapsulation.

AKEPOX® 5030
Adhesive Bonding Technology

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