Bonding SMC to NR

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

SMC

Sheet Molding Compounds

NR

Polyisoprene (natural rubber)


Preview results

Polytec PU 1000 - Electrically Conductive Polyurethane Adhesive
Adhesive Bonding Technology

1-part room-temperature curing, highly flexible polyurethane-adhesive with excellent electrical conductivity. It is used in micro electronics, hybrid and electronic applications.

Kisling 5880
Adhesive Bonding Technology

Black cyanoacrylate adhesive, which has been developed for all applications under thermal and/ or climatic conditions.

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

MD GLUE 150.424
Adhesive Bonding Technology

For universal application with a wide variety of materials. REACH registered.

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