Project Support – Adhesive Bonding Processes
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.
Drei Bond 9160 is an elastic, one-component MS-Polymer. Sealant and adhesive for bonding vehicle bodywork, containers and vehicle manufacture, air conditioning and heating equipment, metal work etc.
Born2Bond™ Structural is a high-strength hybrid adhesive that provides a fast fixture time at room temperature while maintaining good processability and bond gaps up to 5mm.