Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Phenoplast

aluminium

Aluminium


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Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Adhesive Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

Drei Bond 9160
Adhesive Bonding Technology

Drei Bond 9160 is an elastic, one component MS-Polymer. Sealant and adhesive for bonding vehicle bodywork, containers and vehicle manufacture, air conditioning and heating equipment, metal work etc.

Born2Bond™ Structural
Adhesive Bonding Technology

Tough 2K instant adhesive with long open time.

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