Bonding PUR high degree of crosslinking to EPM/EPDM
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Features
Polyurethane (high degree of cross-linking)
Ethylene propylene (diene) rubber
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Born2Bond™ HMPUR HHD 6002 is a high performance adhesive that stands out with high production efficiency, excellent humidity, sebum, temperature and impact resistance.
0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.
MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.
Through the research & development of MS Polymers a success story in bonding technology has been reinvigorated combining the properties of conventional bonding systems like polyurethanes, silicones and acrylates, without the necessity of keeping their weak points.
RAKU® PUR 49-3000 A with RAKU® PUR 49-2030 B is a solvent-free, two-component reaction adhesive that cures at room temperature. The cured adhesive is weather-resistant and is characterized by a high resistance to media and chemicals.