Bonding PUR high degree of crosslinking to EPM/EPDM

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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Features

PUR (higher degree of cross-linking)

Polyurethane (high degree of cross-linking)

EPM/EPDM

Ethylene propylene (diene) rubber


Preview results

Born2Bond™ HMPUR HHD 6002
Adhesive Bonding Technology

Born2Bond™ HMPUR HHD 6002 is a high performance adhesive that stands out with high production efficiency, excellent humidity, sebum, temperature and impact resistance.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

COSMO HD-100.600
Adhesive Bonding Technology

MS sealant for adhesive and sealing applications in various industries with excellent adhesion to EPDM.

RAKU® PUR 49-3000
Adhesive Bonding Technology

RAKU® PUR 49-3000 A with RAKU® PUR 49-2030 B is a solvent-free, two-component reaction adhesive that cures at room temperature. The cured adhesive is weather-resistant and is characterized by a high resistance to media and chemicals.

Born2Bond™ HMPUR HHD 6009
Adhesive Bonding Technology

Born2Bond™ HHD 6009 is a high performance, one-component, solvent-free, moisture curing hot-melt polyurethane adhesive, with excellent flow behavior and high adhesion to metal and glass.

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