Project Support – Adhesive Bonding Processes

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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ARALDITE® 2080 - 05
Adhesive Bonding Technology

A low odor, non-flammable, and primer-free acrylate adhesive with exceptional bond performance and a low toxicity profile.

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

Merbenit 2K20
Adhesive Bonding Technology

Merbenit 2K20 is a self-leveling 2-components sealing compound based on SMP.

tesa® 92108 HiP – High initial Performance
Adhesive Bonding Technology

0.8 mm double-sided foam tape for LSE surfaces: plastic to plastic application in automotive interior.

DuploCOLL® 5015
Adhesive Bonding Technology

Double-sided pressure sensitive adhesive mounting tape with a modified acrylic adhesive and a compressible foam carrier.

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