Microelectronics / optics / sensor systems - bonding of LED-lenses
These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:
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Born2Bond™ HMPUR HHD 6002 is a high performance adhesive that stands out with high production efficiency, excellent humidity, sebum, temperature and impact resistance.
Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.
Adhesive and sealant with high initial adhesion | temperature resistant.
Universal epoxy resin adhesive | viscous | self-levelling | very short pot life | fast-curing | transparent.
Cyanoacrylate adhesive for special requirements | high-temperature-resistant | high viscosity | slow curing | cures with residual elasticity | high peel and impact strength.