Microelectronics / optics / sensor systems - bonding of LED-lenses

These days bonding processes are becoming ever more complex and the projects ever more challenging. Substratec Ltd supports your business in finding suitable adhesive bonding methods, corresponding surface technologies and relevant application systems, both on- and offline:

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LED-lenses

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Born2Bond™ HMPUR HHD 6002
Adhesive Bonding Technology

High performance HMPUR with high initial bonding strength and excellent environmental resistance.

Polytec EC 101 - Electrically Conductive Adhesive
Adhesive Bonding Technology

Two-component heat curing epoxy resin for micro-electronic, medical, hybrids and optoelectronic application. Solventfree, along pot life and excellent electrical conductivity.

Born2Bond™ HMPUR HHD 6009
Adhesive Bonding Technology

High performance HMPUR with excellent fluidity and high bonding on metal and glass.

Polytec EP 610-2 – Unfilled Epoxy Adhesive
Adhesive Bonding Technology

Polytec EP 610-2 is used for stress free bonding of large optical components with different CTE´s.

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