EPOXONIC® 195

Adhesive Bonding Technology

Dual-cure adhesive for Microelectronics and Optoelectronics/Optics.

EPOXONIC® 195 is a solvent-free, UV and/or thermal curing, 1-part-adhesive based on epoxy resin. EPOXONIC® 195 is especially suited for quick fixation and bonding of devices and joining of various substrates like metals, plastics and glass.

Main characteristics:

  • Dual-cure
  • Low viscosity
  • Impact resistance
  • Transparency
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Adhesive
Components
1-part systems
1-part systems
1-part epoxy resins
Thermoplastics
PA
PBT
PC
PET
Thermosetting Plastics
EP
HPL
Composites
FR4
Metals
aluminium
steel - blasted SA 2,5
Glass & Ceramic Materials
glass
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
warm-/hot curing
UV-/ light curing
Pot life @ +20/23°C - Minimum / seconds
11-30 sec
31-59 sec
(Mixed) viscosity
medium viscosity
Packaging unit
cartridge (1- or 2-part)
customized packaging
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +130°C
to +140°C
to +150°C
colour and colour fastness
transparent
colour spectrum bright
yellow
Shore-D
Sh-D 81 to 100
Ecological requirements
VOC-free
White Goods & Consumer Electronics / microelectronics / optics / sensor systems
components & housings

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