EPOXONIC GmbH Reaktionsharzsysteme

Adhesive Bonding Technology

EPOXONIC - we love epoxies

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds based on epoxy technology.

Epoxy resin formulations, also lovingly known as EPOXIES, are versatile plastics that are found in almost all areas of daily life. We not only offer individual custom solutions from the field of special resins but also have suitable standard products for industrial applications in our product portfolio.

We develop tailor-made products that meet your individual requirements. Feel free to talk to us so that we can check and implement your personal product requirements.

Together with our customers we develop individually adjusted systems that are easy to handle but nevertheless make no compromises concerning stability, reliability and long service life. Highlights are high-strength adhesives with outstanding chemical resistance and flexible, temperature resistant adhesives/potting compounds without anhydrides.

Gewerbestr. 16
85652 Landsham/Pliening (Munich)
Germany

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Features

Core competences
Adhesive and sealant technologies
Source of supply for your in-house production
Manufacturer
Sector expertise
Manufacuting industry
Local availability
EUR
Europe
Switzerland
Germany
Austria
Companies A-Z
E-F
Adhesive and sealant systems
Adhesive
Potting
Components
1-part systems
2-part systems
1-part systems
1-part epoxy resins
2-part systems
2-part epoxy resins
Bonding Technologies
manufacturer

Products

EPOXONIC® 195
Adhesive Bonding Technology

Dual-cure adhesive for Microelectronics and Optoelectronics/Optics.

EPOXONIC® 292
Adhesive Bonding Technology

Tough adhesive for Automotive Engineering, Microelectronics, and Electrical Engineering.

EPOXONIC® 366
Adhesive Bonding Technology

Potting compound/Adhesive for Automotive Engineering

EPOXONIC® 370
Adhesive Bonding Technology

Thixotropic, toughened adhesive for Automotive and Electrical Engineering

EPOXONIC® 382
Adhesive Bonding Technology

2-Part-Adhesive suitable for room temperature curing

EPOXONIC® 313 - hot curing
Casting Potting

2-component impregnating resin with a long service life

EPOXONIC® 344 - hot curing
Casting Potting

Potting compound for Automotive Engineering, Microelectronics, Electrical Engineering and Medical Engineering

EPOXONIC® 281- moderate curing temperature
Casting Potting

Potting compound for Microelectronics and Electrical Engineering

EPOXONIC® 283 - moderate curing temperature
Casting Potting

Impact resistant potting compound for Microelectronics and Electrical Engineering

EPOXONIC® 342 - moderate curing temperature
Casting Potting

Low viscosity, heat conductive potting compound for demanding industrial applications

EPOXONIC® 364 - flexible
Casting Potting

Flexible potting compound with high thermal conductivity

EPOXONIC® 373 - flexible
Casting Potting

Flexible, flame-resistant potting compound for Automotive Engineering, Microelectronics and Electrical Engineering

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