EPOXONIC® 364 - flexible

Casting Potting

Flexible potting compound with high thermal conductivity.

EPOXONIC® 364 is a solvent-free, mineral filled 2-part potting compound based on epoxy resin. EPOXONIC® 364 is especially suited for low-stress potting of components and for the thermal conductive connection of heat sinks to electronic assemblies.

Main characteristics:

  • High elongation at break
  • High thermal conductivity
  • Excellent mechanical damping
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacuting industry
Adhesive and sealant systems
Potting
Components
2-part systems
2-part systems
2-part epoxy resins
Size of application area
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
hot curing
Pot life @ +20/23°C - Minimum / minutes
16-30 min
(Mixed) viscosity
low viscosity
Packaging unit
tube, can, canister
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +130°C
to +140°C
to +150°C
colour and colour fastness
grey
Shore-A
Sh-A 61 to 80
conductivity
heat-conductive
deformation capability
≤ 150%
Ecological requirements
VOC-free
Medium nature
filled
Machine & Production Engineering / electrical engineering
casting of components

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