EPOXONIC® 351 - hot curing

Casting Potting

Mechanically high-quality potting compound for automotive technology, microelectronics, electrical engineering and medical technology.

EPOXONIC® 351 is a solvent-free, filler-containing two-component casting resin system based on epoxy resin. EPOXONIC® 351 is particularly suitable for the potting of electronic assemblies (e.g. high-voltage connectors).

Key features:

  • Continuous temperature resistance up to 150 °C
  • Thermal shock resistance
  • Resistance
  • Low viscosity
  • Excellent impact resistance
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EPOXONIC GmbH Reaktionsharzsysteme
Adhesive Bonding Technology

EPOXONIC GmbH specialises in the development and production of highly demanding adhesives and casting compounds.

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Features

Sector expertise
Manufacturing industry
Adhesive and sealant systems
Potting
Components
2-part systems
2-part systems
2-part epoxy resins
Size of application area
µm²-/µm³ range - micro parts
mm²-/mm³range - precision parts
cm²-/cm³ range - component
Curing mechanisms
hot curing
Pot life @ +20/23°C - Minimum / minutes
16-30 min
(Mixed) viscosity
medium viscosity
high viscosity
Packaging unit
hobbock
customized packaging
temperature resistance <0°C (approx.)
from -40°C
from -30°C
from -20°C
temperature resistance >0°C (approx.)
to +130°C
to +140°C
to +150°C
colour and colour fastness
black
Shore-D
Sh-D 81 to 100
deformation capability
≤ 10%
Ecological requirements
VOC-free
Media profile
filled
Machine & Production Engineering / electrical engineering
high voltage plug

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